Ampac Inno-Lok and Pour & Lok

Ampac has announced the addition of Inno-Lok , a patented method of applying a recloseable zipper transversely to packaging films, as well as Pour & Lok, a foldable zipper applied to film in the side gusset area of a package.

The Inno-Lok technology is applied transversely to packaging films, producing pre-zippered roll stock film that can be used in form, fill, seal packaging applications.

Inno-Lok will be offered on Ampac’s coextruded surface printed films and laminated films for barrier and non-barrier end uses.

Pour & Lok is a foldable zipper applied to film in the side gusset area of the package, creating a recloseable pour spout.

Source: Ampac

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