This high-dynamics polygon laser scan system is especially well suited for line-by-line processing of surfaces (e.g. silicon wafers) via high-repetition USP (ultra-short-pulse) lasers.
USP lasers are ideal for high-precision microprocessing of components. Cold ablation enables exceptionally fine and targeted material removal. Yet, to achieve industry suitable productivity, the USP laser must team up with an ultra-swift scanner capable of positioning the individual laser pulses onto a workpiece without pulse overlaps, even at highest pulse rates.
In principle, the high speed of polygon scanners makes them well suited for separating such high-frequency pulses, but pure polygon scanners have limitations in accuracy and flexibility, and have been difficult to integrate into USP processing systems so far.
Scanlab eliminated these drawbacks by developing a hybrid polygon scanner system combining the dynamic superiority of polygon scanners with the high precision of galvanometers.
Source: Scanlab AG
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