Established this year to support and foster packaging education, the $2500 educational scholarship will be presented to a promising undergraduate student who is pursuing a Packaging Science degree from Clemson University (US).
The Future Leaders in Packaging Scholarship has been developed in conjunction with Packaging World’s Leadership in Packaging programme, a community-based print and online programme that enables suppliers to promote their innovation and commitment to the packaging community.
Packaging World Publisher, Joe Angel, said: “Packaging World has been a long time supporter of packaging education, via various association initiatives and editorially.”
Applicants for the 2012 award must be undergraduate degree candidates in Clemson University’s Department of Packaging Science. Clemson’s packaging science department scholarship review board will select the 2012 recipient.
Source: Printpack
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